3DSP and CoWare Partner to Strengthen Design Processes and High-Level Verification for Multi-Core DSP SoC Solutions
IRVINE, Calif.--(BUSINESS WIRE)--March 11, 2002--3DSP Corporation,
the leader in configurable digital signal processor (DSP)
architectures, announced that it has partnered with CoWare(TM), Inc.,
the leading provider of system-level design tools, to strengthen joint
customers' design processes and high-level verification for multi-core
DSP system-on-a-chip (SoC) solutions. This partnership entails
integration of appropriate 3DSP design tools within CoWare's N2C(TM)
design system, a demonstration of which is being provided in the 3DSP
booth number 4652N at the Embedded Systems Conference in San
Francisco, March 13-15, 2002.
3DSP's tools enable designers to quickly optimize DSP system
architecture for their target application, while CoWare's N2C design
system helps engineering teams take their initial design ideas from
napkin-to-chip in half the time of previous design methods.
"Our partnership with CoWare moves multi-core DSP-based SoC
implementation forward by providing 3DSP customers with the ability to
better manage complex product design process flow from initial
specification to production," said Eric Mack, marketing director at
3DSP. "Ultimately this will ensure our customers first-time-right
silicon that is executed in a minimum time."
"Our aim is to provide customers with the most capable
hardware/software co-design environment available for producing
complex multi-core DSP and RISC-based SoCs," said Ed Begun, director
of marketing and business development at CoWare. "Integrating 3DSP's
tools for configurable DSP cores into our N2C design system will
provide a unique combination of system design capabilities to develop
multi-core products for a range of wireless, networking and streaming
multimedia applications."
The demonstration at the Embedded Systems Conference booth 4652N
clearly shows how 3DSP and CoWare capabilities meld to provide a more
robust and flexible design environment for the embedded system
designer. It involves the simulation of a complex multi-core SoC
solution based on an SP-5flex(TM) configurable DSP core and an
ARM7TDMI AHB RISC microprocessor core, and the facilitation of a bus
interconnect between 3DSP's Shuttle intelligent bus and the AMBA
AHP/APB bus employed by the ARM core. The entire platform is simulated
at the cycle accurate C level to achieve outstanding simulation
performance while maintaining accuracy. This demo will also provide
SoC designers with a platform to analyze software performance of the
SP-5flex core within an AC3 decoding application, as a means to
evaluate the performance of this core when internal register and MAC
configurations are varied.
About 3DSP
3DSP offers the industry's only fully configurable digital signal
processing architecture with a comprehensive object-oriented design
environment and application-based intellectual property. 3DSP's
technology empowers system designers to create custom SoC solutions in
silicon that achieve significant competitive advantages in terms of
performance, integration, power consumption, cost and time-to-market
for tomorrow's multimedia, wireless and Voice over Packet
applications. For more information on the company and its products,
visit www.3dsp.com or contact 3DSP headquarters at 16271 Laguna Canyon
Rd., Irvine, CA 92618, phone: 949/435-0600 fax: 949/435-0700.
About CoWare
CoWare, Inc., provides tools and methodologies that help
engineering teams cut their system-on-a-chip design times in half.
CoWare N2C provides an efficient means to capture, analyze, and
implement a system specification, with parallel development by
hardware and software teams. In addition, CoWare N2C greatly enhances
IP re-use and selection, further reducing design time. The CoWare N2C
software is employed by major systems and semiconductor companies
including Alcatel, Fujitsu, Matsushita, Mitsubishi, Motorola, Nokia,
Sony and STMicroelectronics. CoWare is headquartered in Santa Clara,
Calif. USA. For more information, visit www.CoWare.com.
3DSP Corporation, 3DSP, SP-5flex and DSP-Shuttle are trademarks of
3DSP Corporation. N2C is a trademark of CoWare Corporation.
Contact:
3DSP Corporation
Annette Keller, 949/435-0580
akeller@3dsp.com
or
Young Company
Chris Kresch, 310/899-3375
ckresch@youngcompany.com
